| Stage | LSCC | % of rev | SITM | % of rev | Gap · A − B |
|---|---|---|---|---|---|
| Revenue | $291M | 100.00% | $157M | 100.00% | LSCC ×1.85 |
| Gross profit | $196M | 67.39% | $99M | 62.97% | LSCC +4.4pp |
| Operating income | $24M | 8.24% | $8M | 5.22% | LSCC +3.0pp |
| Pre-tax income | $14M | 4.74% | $18M | 11.56% | SITM +6.8pp |
| Net income | $11M | 3.85% | $18M | 11.53% | SITM +7.7pp |
| Stage | LSCC | SITM | Gap · A − B |
|---|---|---|---|
| Revenue | $291M100.00% | $157M100.00% | LSCC ×1.85 |
| Gross profit | 67.39%$196M | 62.97%$99M | LSCC +4.4pp |
| Operating income | 8.24%$24M | 5.22%$8M | LSCC +3.0pp |
| Pre-tax income | 4.74%$14M | 11.56%$18M | SITM +6.8pp |
| Net income |
| 3.85%$11M |
| 11.53%$18M |
| SITM +7.7pp |
LSCC 10-KFeb 14 '25
“Arrow 33.3 % 31.6 % 28.5 %”
SITM 10-KFeb 14 '25
“Pernas directly accounted for 24%, 20%, and 20% of our revenue for the years ended December 31, 2024, 2023, and 2022, respectively, Arrow directly accounted for 19%, 18%, and 17% of our revenue for the years ended December 31, 2024, 2023, and 2022, respectively and Quantek directly accounted for 13%, 13%, and 12% of our revenue for the years ended December 31, 2024, 2023, and 2022, respectively.”
LSCC 10-KFeb 14 '25
“We rely on foundries in Japan, Korea and Taiwan to supply and fabricate silicon wafers for our semiconductor products, including Taiwan Semiconductor Manufacturing, Samsung Semiconductor, United Microelectronics Corporation, and Seiko Epson.”
SITM 10-KFeb 11 '26
“We use Robert Bosch LLC ("Bosch") in Germany, Taiwan Semiconductor Manufacturing Company ("TSMC") and United Microelectronics Corporation ("UMC") in Taiwan, and Teledyne Digital Imaging Inc. ("Teledyne") in Canada as our primary foundries and suppliers for our MEMS timing devices and analog mixed-signal circuit ICs.”
LSCC 10-KFeb 14 '25
“We rely on our OSATs in Malaysia, Taiwan and Japan to support the packaging and test of our products, including Advanced Semiconductor Engineering and Amkor Technology.”
SITM 10-KFeb 11 '26
“Upon the completion of processing at the foundry, we use third-party contractors for packaging, assembly, and testing, including Advanced Semiconductor Engineering, Inc. ("ASE") in Taiwan, Carsem (M) Sdn Bhd. ("Carsem") in Malaysia, United Test and Assembly Center Ltd. ("UTAC") in Thailand, Hana Semiconductor (Ayutthaya) Co., Ltd in Thailand, Daishinku Corp. ("Daishinku") in Japan, and STATS ChipPAC Pte Ltd. in Singapore.”
LSCC 10-KFeb 14 '25
“We partner with United Microelectronics Corporation ("UMC") and its subsidiary United Semiconductor Japan Corporation ("USJC") to manufacture our products on its 130nm, 90nm, 65nm, and 40nm CMOS process technologies, as well as embedded flash memory in these process nodes.”
SITM 10-KFeb 11 '26
“We use Robert Bosch LLC ("Bosch") in Germany, Taiwan Semiconductor Manufacturing Company ("TSMC") and United Microelectronics Corporation ("UMC") in Taiwan, and Teledyne Digital Imaging Inc. ("Teledyne") in Canada as our primary foundries and suppliers for our MEMS timing devices and analog mixed-signal circuit ICs.”