ASX
ASE Technology Holding Co., Ltd.
OpenVolumeMkt capP/EEPSDiv yield
Day – 52-wk –
Expected move
InputsNext report
Last report
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Largest filed tie
13F top-10 QoQ
Top fund weight
ASE Technology Holding Co., Ltd.
Expected move
InputsNext report
Last report
—
Largest filed tie
13F top-10 QoQ
Top fund weight
ASE Technology Holding Co., Ltd.
39.26
−0.24 · −0.61%
Linked news
No changes.
No changes.
| Manager | Value | % base | |
|---|---|---|---|
| BlackRockindex-like | $1.2B | 16.70% | +18.33% |
| Bank of America | $423.6M | 5.97% | +37.38% |
| Goldman Sachs | $374.5M | 5.28% | +42.00% |
| Lazard | $359.6M | 5.07% | −41.09% |
| UBS | $351.4M | 4.95% | −16.12% |
| Manager | Value | % base | |
|---|---|---|---|
| BlackRockindex-like | $1.2B | 16.70% | +18.33% |
| Bank of America | $423.6M | 5.97% | +37.38% |
| Goldman Sachs | $374.5M | 5.28% | +42.00% |
| Lazard | $359.6M | 5.07% | −41.09% |
| UBS | $351.4M | 4.95% | −16.12% |
Same SIC code · 6
Same SEC industry code: Nvidia Corp, Broadcom Inc., Micron Technology Inc and 3 more; of ASE Technology Holding Co., Ltd.'s 6 closest co-movers, 1 shares that code.
Same SIC code · 6
Same SEC industry code: Nvidia Corp, Broadcom Inc., Micron Technology Inc and 3 more; of ASE Technology Holding Co., Ltd.'s 6 closest co-movers, 1 shares that code.
Annual filing, covered
20-F parsed · Apr 1 '26
Supply-chain ties, covered
Disclosed · both directions
Fund holders, covered
N-PORT holdings
13F holdings, covered
13F quarter · Jun 30 '26
Management, not covered
Not covered · DEF 14A, 8-K 5.02
Company IR feed, not covered
News via newswires & EDGAR
Products, patents, hiring, not covered
Not covered
Annual filing, covered
20-F parsed · Apr 1 '26
Supply-chain ties, covered
Disclosed · both directions
Fund holders, covered
N-PORT holdings
13F holdings, covered
13F quarter · Jun 30 '26
Management, not covered
Not covered · DEF 14A, 8-K 5.02
Company IR feed, not covered
News via newswires & EDGAR
Products, patents, hiring, not covered
Not covered
No thesis.
ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.
ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.
Expected move
No implied move.