Sitime Corp
Expected move
InputsNext report
Last report
Largest filed tie
13F top-10 QoQ
Top fund weight
Last report7 of 8 at or beyond impliedshaded = implied▲▼ = realized× = |realized| ÷ implied
+26.58%
vs ±18.7% implied · ×1.42
shaded = implied · ▲▼ = realized
Sitime has 12 disclosed suppliers and 5 disclosed customers in SEC filings.
Sitime Corp
453.54
Note…more than 10% of our revenue in the years ended December 31, 2025, 2024, and 2023
| Year Ended December 31, | |||
|---|---|---|---|
| 2025 | 2024 | 2023 | |
| Pernas Electronics Co. Ltd. | 25% | 24% | 20% |
basisSITM FY2025 revenue $327M
SITM 10-Kaccession 0001451809-26-000012
SentenceUpon the completion of processing at the foundry, we use third-party contractors for packaging, assembly, and testing, including Advanced Semiconductor Engineering, Inc. ("ASE") in Taiwan, Carsem (M) Sdn Bhd. ("Carsem") in Malaysia, United Test and Assembly Center Ltd. ("UTAC") in Thailand, Hana Semiconductor (Ayutthaya) Co., Ltd in Thailand, Daishinku Corp. ("Daishinku") in Japan, and STATS ChipPAC Pte Ltd. in Singapore.
SentenceWe currently rely primarily on Bosch and Teledyne for our MEMS fabrication, and primarily on TSMC for our analog circuits fabrication, and any disruption in the supply of wafers or any increases in the wafer or materials prices could adversely affect our gross margins and our ability to meet customer demands in a timely manner, or at all, and lead to reduced revenue.
SentenceWe use Robert Bosch LLC ("Bosch") in Germany, Taiwan Semiconductor Manufacturing Company ("TSMC") and United Microelectronics Corporation ("UMC") in Taiwan, and Teledyne Digital Imaging Inc. ("Teledyne") in Canada as our primary foundries and suppliers for our MEMS timing devices and analog mixed-signal circuit ICs.
SentenceWe use Robert Bosch LLC ("Bosch") in Germany, Taiwan Semiconductor Manufacturing Company ("TSMC") and United Microelectronics Corporation ("UMC") in Taiwan, and Teledyne Digital Imaging Inc. ("Teledyne") in Canada as our primary foundries and suppliers for our MEMS timing devices and analog mixed-signal circuit ICs.
SentenceUpon the completion of processing at the foundry, we use third-party contractors for packaging, assembly, and testing, including Advanced Semiconductor Engineering, Inc. ("ASE") in Taiwan, Carsem (M) Sdn Bhd. ("Carsem") in Malaysia, United Test and Assembly Center Ltd. ("UTAC") in Thailand, Hana Semiconductor (Ayutthaya) Co., Ltd in Thailand, Daishinku Corp. ("Daishinku") in Japan, and STATS ChipPAC Pte Ltd. in Singapore.
SITM 10-Kaccession 0001451809-26-000012
SentenceWe currently primarily rely on Advanced Semiconductor Engineering, Inc. ("ASE"), Carsem (M) Sdn. Bhd. ("Carsem"), and United Test and Assembly Center Ltd. ("UTAC") for assembly and testing, as well as Daishinku Corp. ("Daishinku"), UTAC, Hana Semiconductor (Ayutthaya) Co., Ltd, and ASE for ceramic packaging for some of our products.
SITM 10-Kaccession 0001451809-25-000034
SentenceUpon the completion of processing at the foundry, we use third-party contractors for packaging, assembly, and testing, including Advanced Semiconductor Engineering, Inc. ("ASE") in Taiwan, Carsem (M) Sdn Bhd. ("Carsem") in Malaysia, United Test and Assembly Center Ltd. ("UTAC") in Thailand, Hana Semiconductor (Ayutthaya) Co., Ltd in Thailand, Daishinku Corp. ("Daishinku") in Japan, and STATS ChipPAC Pte Ltd. in Singapore.
SITM 10-Kaccession 0001451809-26-000012
SentenceWe currently primarily rely on Advanced Semiconductor Engineering, Inc. ("ASE"), Carsem (M) Sdn. Bhd. ("Carsem"), and United Test and Assembly Center Ltd. ("UTAC") for assembly and testing, as well as Daishinku Corp. ("Daishinku"), UTAC, Hana Semiconductor (Ayutthaya) Co., Ltd, and ASE for ceramic packaging for some of our products.
SITM 10-Kaccession 0001451809-25-000034
SentenceOn February 4, 2026, we entered into an asset purchase agreement (the "Asset Purchase Agreement") with Renesas Electronics America Inc., a California corporation ("Renesas"), pursuant to which Renesas will and will cause certain of its affiliates to sell, transfer, assign and convey to SiTime all of their right, title and interest in, to and under certain assets related to the timing business of Renesas Electronics Corporation for an aggregate purchase price of approximately $1,500.0 million in cash ("Cash Consideration") and 4.13 million shares of our common stock (such consideration, the "Stock Consideration"), subject to certain adjustments as set forth in the Asset Purchase Agreement (the "Acquisition").
SITM 10-Kaccession 0001451809-26-000012
SentenceWe have a supply agreement with Bosch under which Bosch has agreed to fabricate our MEMS wafers based on purchase orders placed by us.
SITM 10-Kaccession 0001451809-25-000034
SentenceUpon the completion of processing at the foundry, we use third-party contractors for packaging, assembly, and testing, including Advanced Semiconductor Engineering, Inc. ("ASE") in Taiwan, Carsem (M) Sdn Bhd. ("Carsem") in Malaysia, United Test and Assembly Center Ltd. ("UTAC") in Thailand, Hana Semiconductor (Ayutthaya) Co., Ltd in Thailand, Daishinku Corp. ("Daishinku") in Japan, and STATS ChipPAC Pte Ltd. in Singapore.
SITM 10-Kaccession 0001451809-26-000012
SentenceUpon the completion of processing at the foundry, we use third-party contractors for packaging, assembly, and testing, including Advanced Semiconductor Engineering, Inc. ("ASE") in Taiwan, Carsem (M) Sdn Bhd. ("Carsem") in Malaysia, United Test and Assembly Center Ltd. ("UTAC") in Thailand, Hana Semiconductor (Ayutthaya) Co., Ltd in Thailand, Daishinku Corp. ("Daishinku") in Japan, and STATS ChipPAC Pte Ltd. in Singapore.
SITM 10-Kaccession 0001451809-26-000012
SentencePernas directly accounted for 24%, 20%, and 20% of our revenue for the years ended December 31, 2024, 2023, and 2022, respectively, Arrow directly accounted for 19%, 18%, and 17% of our revenue for the years ended December 31, 2024, 2023, and 2022, respectively and Quantek directly accounted for 13%, 13%, and 12% of our revenue for the years ended December 31, 2024, 2023, and 2022, respectively.
SentencePernas directly accounted for 24%, 20%, and 20% of our revenue for the years ended December 31, 2024, 2023, and 2022, respectively, Arrow directly accounted for 19%, 18%, and 17% of our revenue for the years ended December 31, 2024, 2023, and 2022, respectively and Quantek directly accounted for 13%, 13%, and 12% of our revenue for the years ended December 31, 2024, 2023, and 2022, respectively.
SITM 10-Kaccession 0001451809-25-000034
SentenceSabre directly accounted for 10% of our revenue for the year ended December 31, 2023.
SITM 10-Kaccession 0001451809-25-000034
Expected move
Inputs8Q avg ±19.1%·×0.73·cheap
straddle ±18.0%
spot 447.06exp Nov 20ATM strike 450ATM straddle 94.50IV 110%