Prices via Intrinio. Supplier and customer ties are extracted from SEC filings and carry the sentence they came from. Not investment advice.
Prices via Intrinio. Supplier and customer ties are extracted from SEC filings and carry the sentence they came from. Not investment advice.
Sitime Corp
Price, suppliers and customers from SEC filings, institutional ownership and the next report.
Semiconductors & Related Devices
No intraday reading yet this session.
Each disclosed tie as a share of both companies’ annual revenue. The bigger share is the side that would feel it if the relationship ended.
| Partner | % of their revenue | % of SITM revenue | Skew |
|---|---|---|---|
| AAPLApple Inc. | 0.02% | 22.00% | 1,274× |
| ARWArrow Electronics, Inc. ("Arrow") | 0.20% | 19.00% | 94× |
Sources
sec edgar · verbatim disclosureEach tie, with the sentence that disclosed it. Open a row for the wording and the filing it came from.
“Pernas Electronics Co. Ltd. 25% 24% 20%”
$82M relationship
basisSITM fy2025 · closed 2025-12 $327M
FILING10-K0001451809-26-000012cik 0001451809
“Sales attributable to Apple, our largest end customer accounted for approximately 22%, 21%, and 20% of our revenue for the years ended December 31, 2024, 2023, and 2022, respectively.”
$72M relationship1,274× more of SITM’s book than AAPL’s
basisSITM fy2025 · closed 2025-12 $327MAAPL fy2025 · closed 2025-09 $416B
The two fiscal years close in different months, so the derived share compares periods that do not line up exactly.
“Pernas directly accounted for 24%, 20%, and 20% of our revenue for the years ended December 31, 2024, 2023, and 2022, respectively, Arrow directly accounted for 19%, 18%, and 17% of our revenue for the years ended December 31, 2024, 2023, and 2022, respectively and Quantek directly accounted for 13%, 13%, and 12% of our revenue for the years ended December 31, 2024, 2023, and 2022, respectively.”
$62M relationship94× more of SITM’s book than ARW’s
basisSITM fy2025 · closed 2025-12 $327M
“Pernas directly accounted for 24%, 20%, and 20% of our revenue for the years ended December 31, 2024, 2023, and 2022, respectively, Arrow directly accounted for 19%, 18%, and 17% of our revenue for the years ended December 31, 2024, 2023, and 2022, respectively and Quantek directly accounted for 13%, 13%, and 12% of our revenue for the years ended December 31, 2024, 2023, and 2022, respectively.”
$42M relationship
basisSITM fy2025 · closed 2025-12 $327M
“Sabre directly accounted for 10% of our revenue for the year ended December 31, 2023.”
$33M relationship
basisSITM fy2025 · closed 2025-12 $327M
FILING10-K0001451809-25-000034
“We currently rely primarily on Bosch and Teledyne for our MEMS fabrication, and primarily on TSMC for our analog circuits fabrication, and any disruption in the supply of wafers or any increases in the wafer or materials prices could adversely affect our gross margins and our ability to meet customer demands in a timely manner, or at all, and lead to reduced revenue.”
FILING10-K0001451809-25-000034cik 0001451809
“We currently have a ten-year supply agreement with Bosch for the fabrication of our MEMS wafers.”
FILING10-K0001451809-25-000034cik 0001451809
“We currently primarily rely on Advanced Semiconductor Engineering, Inc. ("ASE"), Carsem (M) Sdn. Bhd. ("Carsem"), and United Test and Assembly Center Ltd. ("UTAC") for assembly and testing, as well as Daishinku Corp. ("Daishinku"), UTAC, Hana Semiconductor (Ayutthaya) Co., Ltd, and ASE for ceramic packaging for some of our products.”
FILING10-K0001451809-25-000034cik 0001451809
“We currently rely primarily on Bosch and Teledyne for our MEMS fabrication, and primarily on TSMC for our analog circuits fabrication, and any disruption in the supply of wafers or any increases in the wafer or materials prices could adversely affect our gross margins and our ability to meet customer demands in a timely manner, or at all, and lead to reduced revenue.”
FILING10-K0001451809-25-000034cik 0001451809
“Also on February 4, 2026, in connection with our entry into the Asset Purchase Agreement, we entered into the Commitment Letter with Wells Fargo, pursuant to which Wells Fargo has committed to provide us with debt financing to fund a portion of the Cash Consideration in an aggregate principal amount of up to $900.0 million in the form of the Bridge Facility.”
FILING10-K0001451809-26-000012cik 0001451809
“On February 4, 2026, we entered into an asset purchase agreement (the "Asset Purchase Agreement") with Renesas Electronics America Inc., a California corporation ("Renesas"), pursuant to which Renesas will and will cause certain of its affiliates to sell, transfer, assign and convey to SiTime all of their right, title and interest in, to and under certain assets related to the timing business of Renesas Electronics Corporation for an aggregate purchase price of approximately $1,500.0 million in cash ("Cash Consideration") and 4.13 million shares of our common stock (such consideration, the "Stock Consideration"), subject to certain adjustments as set forth in the Asset Purchase Agreement (the "Acquisition").”
FILING10-K0001451809-26-000012cik 0001451809
“We use Robert Bosch LLC ("Bosch") in Germany, Taiwan Semiconductor Manufacturing Company ("TSMC") and United Microelectronics Corporation ("UMC") in Taiwan, and Teledyne Digital Imaging Inc. ("Teledyne") in Canada as our primary foundries and suppliers for our MEMS timing devices and analog mixed-signal circuit ICs.”
FILING10-K0001451809-26-000012cik 0001451809
“Upon the completion of processing at the foundry, we use third-party contractors for packaging, assembly, and testing, including Advanced Semiconductor Engineering, Inc. ("ASE") in Taiwan, Carsem (M) Sdn Bhd. ("Carsem") in Malaysia, United Test and Assembly Center Ltd. ("UTAC") in Thailand, Hana Semiconductor (Ayutthaya) Co., Ltd in Thailand, Daishinku Corp. ("Daishinku") in Japan, and STATS ChipPAC Pte Ltd. in Singapore.”
FILING10-K0001451809-26-000012cik 0001451809
“We currently primarily rely on Advanced Semiconductor Engineering, Inc. ("ASE"), Carsem (M) Sdn. Bhd. ("Carsem"), and United Test and Assembly Center Ltd. ("UTAC") for assembly and testing, as well as Daishinku Corp. ("Daishinku"), UTAC, Hana Semiconductor (Ayutthaya) Co., Ltd, and ASE for ceramic packaging for some of our products.”
FILING10-K0001451809-25-000034cik 0001451809
“Upon the completion of processing at the foundry, we use third-party contractors for packaging, assembly, and testing, including Advanced Semiconductor Engineering, Inc. ("ASE") in Taiwan, Carsem (M) Sdn Bhd. ("Carsem") in Malaysia, United Test and Assembly Center Ltd. ("UTAC") in Thailand, Hana Semiconductor (Ayutthaya) Co., Ltd in Thailand, Daishinku Corp. ("Daishinku") in Japan, and STATS ChipPAC Pte Ltd. in Singapore.”
FILING10-K0001451809-26-000012cik 0001451809
“We currently primarily rely on Advanced Semiconductor Engineering, Inc. ("ASE"), Carsem (M) Sdn. Bhd. ("Carsem"), and United Test and Assembly Center Ltd. ("UTAC") for assembly and testing, as well as Daishinku Corp. ("Daishinku"), UTAC, Hana Semiconductor (Ayutthaya) Co., Ltd, and ASE for ceramic packaging for some of our products.”
FILING10-K0001451809-25-000034cik 0001451809
“Upon the completion of processing at the foundry, we use third-party contractors for packaging, assembly, and testing, including Advanced Semiconductor Engineering, Inc. ("ASE") in Taiwan, Carsem (M) Sdn Bhd. ("Carsem") in Malaysia, United Test and Assembly Center Ltd. ("UTAC") in Thailand, Hana Semiconductor (Ayutthaya) Co., Ltd in Thailand, Daishinku Corp. ("Daishinku") in Japan, and STATS ChipPAC Pte Ltd. in Singapore.”
FILING10-K0001451809-26-000012cik 0001451809
“In February 2024, we entered into a Sales Agreement ("Sales Agreement") with Stifel, Nicolaus & Company, Incorporated ("Stifel"), under which we may offer and sell from time to time at our sole discretion, up to an aggregate of 1,200,000 shares of our common stock, par value $0.0001 per share, through Stifel as our sales agent.”
FILING10-K0001451809-26-000012cik 0001451809
“We currently primarily rely on Advanced Semiconductor Engineering, Inc. ("ASE"), Carsem (M) Sdn. Bhd. ("Carsem"), and United Test and Assembly Center Ltd. ("UTAC") for assembly and testing, as well as Daishinku Corp. ("Daishinku"), UTAC, Hana Semiconductor (Ayutthaya) Co., Ltd, and ASE for ceramic packaging for some of our products.”
FILING10-K0001451809-25-000034cik 0001451809
Watchlist prices, news filtered to it, and its next report on your desk.
FILING10-K0001451809-25-000034cik 0001451809
FILING10-K0001451809-25-000034cik 0001451809
Sitime Corp has 14 disclosed suppliers and 5 disclosed customers. Each one is named in an SEC filing, either Sitime Corp’s own annual report or the counterparty’s, and carries the sentence that discloses it.
SITM (Sitime Corp) has 14 disclosed suppliers and 5 disclosed customers, strongest disclosure first.
Suppliers:
Customers:
Select a tie for the filing sentence that discloses it; select again to open the company. Lines are disclosed suppliers and customers, coloured by industry; the closer to the centre, the more the filings disclose. A dot is green or red by today’s move, and a bundle sits past the rings until you open it. Extended: satellites hang off single companies, not bundled sectors.
Largest move on the map today: WFC +1.29%, in financials.