AMKR
Amkor Technology, Inc.
OpenVolumeMkt capP/EEPSDiv yield
Day – 52-wk –
Expected move
InputsNext report
Last report
Largest filed tie
13F top-10 QoQ
Top fund weight
Amkor Technology, Inc.
Expected move
InputsNext report
Last report
Largest filed tie
13F top-10 QoQ
Top fund weight
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip-scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip-chip stacked chip-scale packages that are used to stack memory on top of digital baseband, and as applications processors in mobile devices; and flip-chip ball grid array packages for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count analog and mixed-signal applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip-scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip-chip stacked chip-scale packages that are used to stack memory on top of digital baseband, and as applications processors in mobile devices; and flip-chip ball grid array packages for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count analog and mixed-signal applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.
No other changes.
No other changes.
Last reportshaded = implied▲▼ = realized× = |realized| ÷ implied
No thesis.
Annual filing, covered
10-K parsed · Feb 20 '26
Supply-chain ties, covered
Disclosed · both directions
Fund holders, covered
N-PORT holdings
13F holdings, covered
13F quarter · Jun 30 '26
Management, not covered
Not covered · DEF 14A, 8-K 5.02
Company IR feed, not covered
News via newswires & EDGAR
Products, patents, hiring, not covered
Not covered
Annual filing, covered
10-K parsed · Feb 20 '26
Supply-chain ties, covered
Disclosed · both directions
Fund holders, covered
N-PORT holdings
13F holdings, covered
13F quarter · Jun 30 '26
Management, not covered
Not covered · DEF 14A, 8-K 5.02
Company IR feed, not covered
News via newswires & EDGAR
Products, patents, hiring, not covered
Not covered
Same SIC code · 6
Same SEC industry code: Nvidia Corp, Broadcom Inc., Micron Technology Inc and 3 more; of Amkor Technology, Inc.'s 6 closest co-movers, 1 shares that code.
Same SIC code · 6
Same SEC industry code: Nvidia Corp, Broadcom Inc., Micron Technology Inc and 3 more; of Amkor Technology, Inc.'s 6 closest co-movers, 1 shares that code.
Amkor Technology, Inc.
39.50
−1.71 · −4.15%
post 39.59 +0.23%
| Manager | Value | % base | |
|---|---|---|---|
| BlackRockindex-like | $1.1B | 10.09% | −5.21% |
| Vanguard Portfolioindex-like | $837.5M | 7.98% | +6.78% |
| Dimensional | $695.3M | 6.62% | −26.63% |
| Vanguardindex-like | $577.8M | 5.50% | +23.31% |
| JPMorgan Chase | $470.0M | 4.48% | new |
| Manager | Value | % base | |
|---|---|---|---|
| BlackRockindex-like | $1.1B | 10.09% | −5.21% |
| Vanguard Portfolioindex-like | $837.5M | 7.98% | +6.78% |
| Dimensional | $695.3M | 6.62% | −26.63% |
| Vanguardindex-like | $577.8M | 5.50% | +23.31% |
| JPMorgan Chase | $470.0M | 4.48% | new |
Tall tick = annual report · Source: EDGAR
Linked news
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Expected move
No implied move.