CRDO 10-KJul 2 '25
“• Package, Assembly and Testing : Upon the completion of processing at the foundry, we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products.”
ALAB 10-KFeb 14 '25
“We also use Advanced Semiconductor Engineering and Amkor Technologies to assemble, package, and test our integrated circuits.”
None
CRDO 10-KJun 15 '26
“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products”
ALAB 10-KFeb 14 '25
“We also use Advanced Semiconductor Engineering and Amkor Technologies to assemble, package, and test our integrated circuits.”