UMC · LSCC 10-KFeb 14 '25
“We partner with United Microelectronics Corporation ("UMC") and its subsidiary United Semiconductor Japan Corporation ("USJC") to manufacture our products on its 130nm, 90nm, 65nm, and 40nm CMOS process technologies, as well as embedded flash memory in these process nodes.”
ASX · LSCC 10-KFeb 14 '25
“We rely on our OSATs in Malaysia, Taiwan and Japan to support the packaging and test of our products, including Advanced Semiconductor Engineering and Amkor Technology.”
UMC · SITM 10-KFeb 11 '26
“We use Robert Bosch LLC ("Bosch") in Germany, Taiwan Semiconductor Manufacturing Company ("TSMC") and United Microelectronics Corporation ("UMC") in Taiwan, and Teledyne Digital Imaging Inc. ("Teledyne") in Canada as our primary foundries and suppliers for our MEMS timing devices and analog mixed-signal circuit ICs.”
ASX · SITM 10-KFeb 11 '26
“Upon the completion of processing at the foundry, we use third-party contractors for packaging, assembly, and testing, including Advanced Semiconductor Engineering, Inc. ("ASE") in Taiwan, Carsem (M) Sdn Bhd. ("Carsem") in Malaysia, United Test and Assembly Center Ltd. ("UTAC") in Thailand, Hana Semiconductor (Ayutthaya) Co., Ltd in Thailand, Daishinku Corp. ("Daishinku") in Japan, and STATS ChipPAC Pte Ltd. in Singapore.”
UMC · MXL 10-KJan 29 '26
“Our key foundry partners include Taiwan Semiconductor Manufacturing Corporation, or TSMC, in Taiwan, and United Microelectronics Corporation, or UMC, in Taiwan and Singapore.”
ASX · MXL 10-KJan 29 '26
“The majority of our assembly/packaging and test requirements are supported by the following independent subcontractors: Advanced Semiconductor Engineering, or ASE, Greatek Electronics, Inc., Signetics Corporation, SIGURD Microelectronics Corp., and Silicon Precision Industries.”
UMC · GCTS 10-KMar 25 '26
“In general, we do not have long-term supply agreements with our foundry, test, assembly and other vendors other than a framework agreement with UMC.”
ASX · GCTS 10-KMar 25 '26
“We use Hana Micron, Stats ChipPAC, and Advanced Semiconductor Engineering, Inc., ("ASE") for most of our assembly and testing requirements on a purchase order basis.”