Prices via Intrinio. Supplier and customer ties are extracted from SEC filings and carry the sentence they came from. Not investment advice.
Prices via Intrinio. Supplier and customer ties are extracted from SEC filings and carry the sentence they came from. Not investment advice.
Prev close 172.66 · gapped below the open, then crossed back over prior close. High/low 173.66 at 2:15 pm ET, 165.24 at 7:00 am ET.
Sources
sec edgar · verbatim disclosureEach tie, with the sentence that disclosed it. Open a row for the wording and the filing it came from.
“Some of the components important to our business, including certain Central Processing Units ("CPUs") from Intel Corporation ("Intel") and Advanced Micro Devices, Inc. ("AMD"), network and wireless chips from Broadcom Inc. ("Broadcom"), Marvell Technology Group Ltd. ("Marvell"), Qualcomm Incorporated ("Qualcomm") and Intel and memory devices from Intel, Micron Technology ("Micron"), ADATA Technology Co., Ltd. ("ADATA"), Toshiba Corporation ("Toshiba"), Samsung Electronics Co., Ltd. ("Samsung"), and Western Digital Technologies, Inc. ("Western Digital"), are available from limited or sole sources of supply.”
FILING10-K0001262039-26-000007cik 0001262039
“Some of the components important to our business, including certain Central Processing Units ("CPUs") from Intel Corporation ("Intel") and Advanced Micro Devices, Inc. ("AMD"), network and wireless chips from Broadcom Inc. ("Broadcom"), Marvell Technology Group Ltd. ("Marvell"), Qualcomm Incorporated ("Qualcomm") and Intel and memory devices from Intel, Micron Technology ("Micron"), ADATA Technology Co., Ltd. ("ADATA"), Toshiba Corporation ("Toshiba"), Samsung Electronics Co., Ltd. ("Samsung"), and Western Digital Technologies, Inc. ("Western Digital"), are available from limited or sole sources of supply.”
FILING10-K0001262039-26-000007cik 0001262039
“Some of the components important to our business, including certain Central Processing Units ("CPUs") from Intel Corporation ("Intel") and Advanced Micro Devices, Inc. ("AMD"), network and wireless chips from Broadcom Inc. ("Broadcom"), Marvell Technology Group Ltd. ("Marvell"), Qualcomm Incorporated ("Qualcomm") and Intel and memory devices from Intel, Micron Technology ("Micron"), ADATA Technology Co., Ltd. ("ADATA"), Toshiba Corporation ("Toshiba"), Samsung Electronics Co., Ltd. ("Samsung"), and Western Digital Technologies, Inc. ("Western Digital"), are available from limited or sole sources of supply.”
FILING10-K0001262039-26-000007cik 0001262039
“Some of the components important to our business, including certain Central Processing Units ("CPUs") from Intel Corporation ("Intel") and Advanced Micro Devices, Inc. ("AMD"), network and wireless chips from Broadcom Inc. ("Broadcom"), Marvell Technology Group Ltd. ("Marvell"), Qualcomm Incorporated ("Qualcomm") and Intel and memory devices from Intel, Micron Technology ("Micron"), ADATA Technology Co., Ltd. ("ADATA"), Toshiba Corporation ("Toshiba"), Samsung Electronics Co., Ltd. ("Samsung"), and Western Digital Technologies, Inc. ("Western Digital"), are available from limited or sole sources of supply.”
FILING10-K0001262039-26-000007cik 0001262039
“Some of the components important to our business, including certain Central Processing Units ("CPUs") from Intel Corporation ("Intel") and Advanced Micro Devices, Inc. ("AMD"), network and wireless chips from Broadcom Inc. ("Broadcom"), Marvell Technology Group Ltd. ("Marvell"), Qualcomm Incorporated ("Qualcomm") and Intel and memory devices from Intel, Micron Technology ("Micron"), ADATA Technology Co., Ltd. ("ADATA"), Toshiba Corporation ("Toshiba"), Samsung Electronics Co., Ltd. ("Samsung"), and Western Digital Technologies, Inc. ("Western Digital"), are available from limited or sole sources of supply.”
FILING10-K0001262039-26-000007cik 0001262039
“Some of the components important to our business, including certain Central Processing Units ("CPUs") from Intel Corporation ("Intel") and Advanced Micro Devices, Inc. ("AMD"), network and wireless chips from Broadcom Inc. ("Broadcom"), Marvell Technology Group Ltd. ("Marvell"), Qualcomm Incorporated ("Qualcomm") and Intel and memory devices from Intel, Micron Technology ("Micron"), ADATA Technology Co., Ltd. ("ADATA"), Toshiba Corporation ("Toshiba"), Samsung Electronics Co., Ltd. ("Samsung"), and Western Digital Technologies, Inc. ("Western Digital"), are available from limited or sole sources of supply.”
FILING10-K0001262039-26-000007cik 0001262039
“These contract manufacturers use foundries in Taiwan and Japan operated by either Taiwan Semiconductor Manufacturing Company Limited ("TSMC") or by the contract manufacturer itself.”
FILING10-K0001262039-26-000007cik 0001262039
“Some of the components important to our business, including certain Central Processing Units ("CPUs") from Intel Corporation ("Intel") and Advanced Micro Devices, Inc. ("AMD"), network and wireless chips from Broadcom Inc. ("Broadcom"), Marvell Technology Group Ltd. ("Marvell"), Qualcomm Incorporated ("Qualcomm") and Intel and memory devices from Intel, Micron Technology ("Micron"), ADATA Technology Co., Ltd. ("ADATA"), Toshiba Corporation ("Toshiba"), Samsung Electronics Co., Ltd. ("Samsung"), and Western Digital Technologies, Inc. ("Western Digital"), are available from limited or sole sources of supply.”
FILING10-K0001262039-26-000007cik 0001262039
“Our current manufacturing partners include Accton Technology ("Accton"), IBASE Technology, Inc. ("IBASE"), Micro-Star International Co. ("Micro-Star"), Senao Networks, Inc. ("Senao"), Wistron Corporation ("Wistron"), and a number of other manufacturers.”
FILING10-K0001262039-26-000007cik 0001262039
“Some of the components important to our business, including certain Central Processing Units ("CPUs") from Intel Corporation ("Intel") and Advanced Micro Devices, Inc. ("AMD"), network and wireless chips from Broadcom Inc. ("Broadcom"), Marvell Technology Group Ltd. ("Marvell"), Qualcomm Incorporated ("Qualcomm") and Intel and memory devices from Intel, Micron Technology ("Micron"), ADATA Technology Co., Ltd. ("ADATA"), Toshiba Corporation ("Toshiba"), Samsung Electronics Co., Ltd. ("Samsung"), and Western Digital Technologies, Inc. ("Western Digital"), are available from limited or sole sources of supply.”
FILING10-K0001262039-26-000007cik 0001262039
“Our current manufacturing partners include Accton Technology ("Accton"), IBASE Technology, Inc. ("IBASE"), Micro-Star International Co. ("Micro-Star"), Senao Networks, Inc. ("Senao"), Wistron Corporation ("Wistron"), and a number of other manufacturers.”
FILING10-K0001262039-26-000007cik 0001262039
“Our current manufacturing partners include Accton Technology ("Accton"), IBASE Technology, Inc. ("IBASE"), Micro-Star International Co. ("Micro-Star"), Senao Networks, Inc. ("Senao"), Wistron Corporation ("Wistron"), and a number of other manufacturers.”
FILING10-K0001262039-26-000007cik 0001262039
“Our proprietary ASICs, which are key to the performance of our appliances, are built by contract manufacturers including Toshiba America Electronic Components, Inc. ("Toshiba America") and Renesas Electronics America, Inc. ("Renesas").”
FILING10-K0001262039-26-000007cik 0001262039
“Some of the components important to our business, including certain Central Processing Units ("CPUs") from Intel Corporation ("Intel") and Advanced Micro Devices, Inc. ("AMD"), network and wireless chips from Broadcom Inc. ("Broadcom"), Marvell Technology Group Ltd. ("Marvell"), Qualcomm Incorporated ("Qualcomm") and Intel and memory devices from Intel, Micron Technology ("Micron"), ADATA Technology Co., Ltd. ("ADATA"), Toshiba Corporation ("Toshiba"), Samsung Electronics Co., Ltd. ("Samsung"), and Western Digital Technologies, Inc. ("Western Digital"), are available from limited or sole sources of supply.”
FILING10-K0001262039-26-000007cik 0001262039
“Our current manufacturing partners include Accton Technology ("Accton"), IBASE Technology, Inc. ("IBASE"), Micro-Star International Co. ("Micro-Star"), Senao Networks, Inc. ("Senao"), Wistron Corporation ("Wistron"), and a number of other manufacturers.”
FILING10-K0001262039-26-000007cik 0001262039
“Our proprietary ASICs, which are key to the performance of our appliances, are built by contract manufacturers including Toshiba America Electronic Components, Inc. ("Toshiba America") and Renesas Electronics America, Inc. ("Renesas").”
FILING10-K0001262039-26-000007cik 0001262039
“Some of the components important to our business, including certain Central Processing Units ("CPUs") from Intel Corporation ("Intel") and Advanced Micro Devices, Inc. ("AMD"), network and wireless chips from Broadcom Inc. ("Broadcom"), Marvell Technology Group Ltd. ("Marvell"), Qualcomm Incorporated ("Qualcomm") and Intel and memory devices from Intel, Micron Technology ("Micron"), ADATA Technology Co., Ltd. ("ADATA"), Toshiba Corporation ("Toshiba"), Samsung Electronics Co., Ltd. ("Samsung"), and Western Digital Technologies, Inc. ("Western Digital"), are available from limited or sole sources of supply.”
FILING10-K0001262039-26-000007cik 0001262039
“Our current manufacturing partners include Accton Technology ("Accton"), IBASE Technology, Inc. ("IBASE"), Micro-Star International Co. ("Micro-Star"), Senao Networks, Inc. ("Senao"), Wistron Corporation ("Wistron"), and a number of other manufacturers.”
FILING10-K0001262039-26-000007cik 0001262039
“Our key offerings include products from Hewlett Packard Enterprise (HPE)/Aruba, Cisco Systems, Palo Alto Networks, Nutanix, Dell EMC, Juniper Networks, Varonis, Cato Networks, Fortinet, Microsoft and Barracuda.”
FILING10-K0000356037-25-000065cik 0000356037disclosed by CSPI
“We work with many technology distributors, including Arrow Electronics, Inc., Exclusive, Ingram Micro, and TD Synnex.”
FILING10-K0001262039-26-000007cik 0001262039
“We work with many technology distributors, including Arrow Electronics, Inc., Exclusive, Ingram Micro, and TD Synnex.”
FILING10-K0001262039-26-000007cik 0001262039
“We work with many technology distributors, including Arrow Electronics, Inc., Exclusive, Ingram Micro, and TD Synnex.”
FILING10-K0001262039-26-000007cik 0001262039
Watchlist prices, news filtered to it, and its next report on your desk.
Fortinet, Inc.
Price, suppliers and customers from SEC filings, institutional ownership and the next report.
Nasdaq · Computer Peripheral Equipment, NEC
Fortinet, Inc. has 18 disclosed suppliers and 4 disclosed customers. Each one is named in an SEC filing, either Fortinet, Inc.’s own annual report or the counterparty’s, and carries the sentence that discloses it.
FTNT (Fortinet, Inc.) has 18 disclosed suppliers and 4 disclosed customers, strongest disclosure first.
Suppliers:
Customers:
Select a tie for the filing sentence that discloses it; select again to open the company. Lines are disclosed suppliers and customers, coloured by industry; the closer to the centre, the more the filings disclose. A dot is green or red by today’s move, and a bundle sits past the rings until you open it. Extended: satellites hang off single companies, not bundled sectors.
Largest move on the map today: ARW +0.51%, in consumer.